Acm Research, Inc. - Company Information

Founded in 1998 in silicon valley, acm research, inc. provides wet processing technology, systems, and key manufacturing products targeted to a range of semiconductor ic manufacturing and wafer-level packaging applications. the company specializes in developing cleaning technologies for advanced semiconductor device manufacturing. known for its expertise in ultra-low-k dielectric and copper integration, the company initially focused on stress-free copper polishing technology. its first product was introduced in 2001 and sold to leading-edge wafer manufacturers in the u.s. in 2003, to address increasing challenges in defect reduction that plagued emerging generations of ic chips, acm research developed its innovative single-wafer cleaning equipment, which features the company's proprietary space alternated phase shift (saps™) and timely energized bubble oscillation (tebo™) megasonic cleaning technologies. in particular, acm's revolutionary tebo technology is enabling future generations of semiconductor capability. these capabilities are delivered on high-throughput chamber and platform designs. in september 2006, acm expanded its operations into asia, and formed the subsidiary acm research (shanghai), inc. the company offers complete r&d, and engineering and manufacturing operations at its zhangjiang hi-tech park facility in shanghai. product lines ic: feol single-wafer clean beol single-wafer clean backside clean bench pr stripper wet bench single wafer recycle ecp sfp furnace advanced wlp: coater developer pr stripper scrubber wet etcher ecp furnace wafer manufacturing: single-wafer clean single-wafer wet etcher furnace

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