Flipchip International - Company Information
Flipchip international (fci) supplies turnkey semiconductor assembly and test services to the consumer, automotive, aerospace and medical industries through our leadership in high volume wafer level packaging and advanced packaging technologies. fci was an early developer of wafer-level chip scale packaging and remains the technology leader in this field with many patented technologies spanning from cu pillar bumping, spheron™ wlcsp, chipsett™ embedded die packaging, and flipchip on leadframe assembly. fci supports a wide range of customers from each industry, frequently partnering with them to engineer customized solutions. fci has a global footprint, offering high volume advanced packaging services from iso/ts 16949-certified factories located in phoenix, arizona, usa, and shanghai, china
Semiconductors
Flipchip International - Technology Stack
Find prospects by the technologies they use. Use this section to learn more about key technologies and tools, tracked by Sprouts.ai, used by Flipchip International.
Materialize
Some quick example text to build on the card title and make up the bulk of the card&aposs content.
Javascript
Some quick example text to build on the card title and make up the bulk of the card&aposs content.
Vue.js
Some quick example text to build on the card title and make up the bulk of the card&aposs content.
TweenMax
Some quick example text to build on the card title and make up the bulk of the card&aposs content.
Polyfill
Some quick example text to build on the card title and make up the bulk of the card&aposs content.
PHP
Some quick example text to build on the card title and make up the bulk of the card&aposs content.
Employee profile
John Doe
CEO
Samantha Duncan
CTO
Gary Austin
MD
Jonathan Shaw
CMD
Janice May
MD
Janet McDonald
CFO
Flipchip International - Company Information
Flipchip international (fci) supplies turnkey semiconductor assembly and test services to the consumer, automotive, aerospace and medical industries through our leadership in high volume wafer level packaging and advanced packaging technologies. fci was an early developer of wafer-level chip scale packaging and remains the technology leader in this field with many patented technologies spanning from cu pillar bumping, spheron™ wlcsp, chipsett™ embedded die packaging, and flipchip on leadframe assembly. fci supports a wide range of customers from each industry, frequently partnering with them to engineer customized solutions. fci has a global footprint, offering high volume advanced packaging services from iso/ts 16949-certified factories located in phoenix, arizona, usa, and shanghai, china
Semiconductors
Flipchip International - Technology Stack
Find prospects by the technologies they use. Use this section to learn more about key technologies and tools, tracked by Sprouts.ai, used by Flipchip International.
Materialize
Some quick example text to build on the card title and make up the bulk of the card&aposs content.
Javascript
Some quick example text to build on the card title and make up the bulk of the card&aposs content.
Vue.js
Some quick example text to build on the card title and make up the bulk of the card&aposs content.
TweenMax
Some quick example text to build on the card title and make up the bulk of the card&aposs content.
Polyfill
Some quick example text to build on the card title and make up the bulk of the card&aposs content.
PHP
Some quick example text to build on the card title and make up the bulk of the card&aposs content.
Employee profile
John Doe
CEO
Samantha Duncan
CTO
Gary Austin
MD
Jonathan Shaw
CMD
Janice May
MD
Janet McDonald
CFO
